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Bills/119th Congress · House

H.R. 6058

Introduced

STRIDE Act

Sponsor
RBill Huizenga· Michigan
Introduced
November 17, 2025
Policy area
International Affairs
Latest action
Ordered to be Reported (Amended) by the Yeas and Nays: 44 - 0.April 22, 2026
[Congressional Bills 119th Congress]
[From the U.S. Government Publishing Office]
[H.R. 6058 Introduced in House (IH)]

<DOC>

119th CONGRESS
1st Session
H. R. 6058

To provide for multilateral semiconductor technology supply chain 
coordination, and for other purposes.

_______________________________________________________________________

IN THE HOUSE OF REPRESENTATIVES

November 17, 2025

Mr. Huizenga (for himself, Mr. Moylan, and Mr. Crenshaw) introduced the 
following bill; which was referred to the Committee on Foreign Affairs

_______________________________________________________________________

A BILL

To provide for multilateral semiconductor technology supply chain 
coordination, and for other purposes.

Be it enacted by the Senate and House of Representatives of the 
United States of America in Congress assembled,

SECTION 1. SHORT TITLE.

This Act may be cited as the ``Semiconductor Technology Resilience, 
Integrity, and Defense Enhancement Act'' or the ``STRIDE Act''.

SEC. 2. SENSE OF CONGRESS.

It is the sense of Congress that--
(1) the global semiconductor technology supply chain is 
critical to United States and allied national security, 
economic competitiveness, and technological leadership;
(2) the Chinese Communist Party is pursuing strategies to 
dominate the semiconductor technology industry to assist in its 
military modernization efforts and human rights abuses through 
non-market practices, export control violation and avoidance, 
economic espionage, military-civil fusion, and predatory 
investment;
(3) the integrity of the global semiconductor technology 
supply chain requires coordinated action with allied and 
partner nations to prevent technological capture by the Chinese 
Communist Party and other foreign adversaries;
(4) unilateral export controls for protecting critical 
semiconductor technologies can be amplified with multilateral 
coordination; and
(5) fully utilizing certain unilateral United States export 
control authorities, including the Foreign Direct Product Rule, 
has proven effective at preventing circumvention or avoidance 
of United States export controls through third-country 
production.

SEC. 3. STATEMENT OF POLICY.

It is the policy of the United States to--
(1) maintain United States and allied partner technological 
leadership in semiconductor technology research, design, 
manufacturing, and advanced materials;
(2) prevent adversarial capture of key chokepoints in the 
global semiconductor technology supply chain;
(3) coordinate with allied and partner nations to expand 
and enhance semiconductor technology protection;
(4) ensure that United States-origin technology and 
intellectual property, including the direct products of United 
States-origin technology, do not contribute to the Chinese 
Communist Party's military modernization, human rights abuses, 
and pursuit of technological dominance over the United States 
and its allies and partners; and
(5) promote resilient, secure, and trusted semiconductor 
supply chains among United States allies and partners.

SEC. 4. MULTILATERAL SEMICONDUCTOR TECHNOLOGY SUPPLY CHAIN 
COORDINATION.

(a) In General.--The Secretary of State shall coordinate with 
governments of countries that maintain significant capabilities in 
semiconductor technology research, design, manufacturing, materials, 
equipment, or equipment subsystems and components to establish 
coordinated and expanded approaches for protecting critical 
semiconductor technologies from acquisition by the Chinese Communist 
Party and other foreign adversaries of the United States and its allies 
and partners.
(b) Coordination Objectives.--In carrying out subsection (a), the 
Secretary of State shall seek to achieve--
(1) alignment of export control policies regarding 
semiconductor technology manufacturing equipment, including 
lithography systems, deposition equipment, etching tools, 
thermocompression bonding equipment, resist processing tools, 
chemical mechanical planarization tools, cleaning tools, 
handling tools, assembly, packaging, and test tools, and 
inspection systems and the critical subcomponents needed to 
produce such equipment;
(2) expanded restrictions on semiconductor technology 
design tools, intellectual property transfers, equipment 
servicing, and technical assistance that could enable 
indigenous semiconductor technology development capabilities in 
countries of concern;
(3) harmonized approaches to controlling dual-use 
semiconductor technology materials, including photoresists, 
specialty gases, and advanced substrates;
(4) joint monitoring, enforcement, and administration 
mechanisms to prevent circumvention of semiconductor technology 
controls through third-country entities as well as prevent 
foreign backfilling of restricted items;
(5) information sharing regarding semiconductor technology 
transfer risks, end-user verification, and supply chain 
security threats; and
(6) establishment of trusted supplier networks for critical 
semiconductor technology components and manufacturing services.
(c) Consequences for Non-Cooperation.--
(1) Assessment of cooperation.--The Secretary of State, in 
consultation with the Secretary of Commerce, shall regularly 
assess the extent to which countries engaged pursuant to 
subsection (a) are implementing measures consistent with United 
States policy described in section 3.
(2) Determination of insufficient security measures.--If 
the Secretary of State determines that a country engaged with 
pursuant to subsection (a) is not implementing security 
measures sufficient to fully prevent semiconductor technology 
transfer to countries of concern, the Secretary shall--
(A) provide a detailed explanation of the specific 
deficiencies in the country's semiconductor technology 
protection measures;
(B) request the Secretary of Commerce to convene a 
meeting of the Export Advisory Review Board to identify 
and execute a plan of action to address the 
insufficient security measures within 21 days of the 
Secretary of State's determination of inadequate 
cooperation; and
(C) notify the appropriate congressional committees 
of such determination not later than 30 days after 
making such determination and provide routine updates 
on the Export Advisory Review Board meeting request and 
plan of action described in subparagraph (B).
(3) Enhanced foreign direct product rule application.--In 
carrying out the process described in paragraph (2)(B), the 
Secretary of State shall provide to Export Advisory Review 
Board--
(A) recommendations for the application of Foreign 
Direct Product Rule restrictions to semiconductor 
technology produced in the non-cooperating country that 
incorporate United States-origin technology, software, 
or equipment;
(B) recommended entities for the expansion of 
Entity List designations for semiconductor technology 
supply chain companies or research institutions in the 
non-cooperating country that pose technology transfer 
risks; and
(C) guidance on what additional steps may be needed 
to prevent foreign backfilling of U.S. technology in 
restricted sectors or entities in countries of concern.
(d) Reports.--
(1) In general.--Not later than 90 days after the date of 
enactment of this Act, and every 90 days thereafter, the 
Secretary of State shall submit to the appropriate 
congressional committees a report on--
(A) the status of diplomatic engagement with key 
semiconductor technology-producing countries;
(B) progress toward achieving the coordination 
objectives specified in subsection (b);
(C) any determinations of inadequate cooperation 
made under subsection (c); and
(D) the effectiveness of multilateral coordination 
in preventing semiconductor technology transfer to 
countries of concern.
(2) Form.--The report required by this subsection shall be 
submitted in unclassified form but may include a classified 
annex.
(e) Definitions.--In this section:
(1) Appropriate congressional committees.--The term 
``appropriate congressional committees'' means--
(A) the Committee on Foreign Affairs of the House 
of Representatives; and
(B) the Committee on Foreign Relations and the 
Committee on Banking, Housing, and Urban Affairs of the 
Senate.
(2) Countries of concern.--The term ``countries of 
concern'' has the meaning given the term ``covered nation'' in 
section 4872(f) of title 10, United States Code.
(3) Entity list.--The term ``Entity List'' means the list 
maintained by the Bureau of Industry and Security of the 
Department of Commerce and set forth in Supplement No. 4 to 
part 744 of title 15, Code of Federal Regulations, or successor 
regulations.
(4) Foreign direct product rule.--The term ``Foreign Direct 
Product Rule'' means the rule exercising United States export 
controls on an item produced in a foreign country for shipment 
or transmission to another foreign country or foreign person, 
if the item--
(A) is produced using technology or software that 
is otherwise subject to the jurisdiction of the United 
States;
(B) is produced with the use of a plant or major 
component of a plant that--
(i) is located outside the United States; 
and
(ii) has been created using the technology 
or software described in subparagraph (A); or
(C) contains, is commingled with, is bundled with, 
is drawn from, or is produced by an item described in 
subparagraph (A) or (B).
(5) Semiconductor technology.--The term ``semiconductor 
technology'' includes--
(A) integrated circuits, microprocessors, and 
memory devices;
(B) semiconductor manufacturing equipment and 
tools, including subsystems and components;
(C) semiconductor design software and intellectual 
property;
(D) semiconductor materials and specialty 
chemicals;
(E) testing, assembly, and packaging equipment; and
(F) any technology, component, or service that is 
essential to semiconductor design, manufacturing, or 
testing processes.
<all>

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