H.R. 6207

[Congressional Bills 119th Congress]
[From the U.S. Government Publishing Office]
[H.R. 6207 Introduced in House (IH)]

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119th CONGRESS
1st Session
H. R. 6207

To prohibit purchases of certain semiconductor manufacturing equipment 
from foreign entities of concern or subsidiaries of foreign entities of 
concern, and for other purposes.

_______________________________________________________________________

IN THE HOUSE OF REPRESENTATIVES

November 20, 2025

Ms. Lofgren (for herself, Mr. Obernolte, Mr. Krishnamoorthi, Mr. 
Moolenaar, Mr. Landsman, and Mrs. Houchin) introduced the following 
bill; which was referred to the Committee on Energy and Commerce, and 
in addition to the Committee on Science, Space, and Technology, for a 
period to be subsequently determined by the Speaker, in each case for 
consideration of such provisions as fall within the jurisdiction of the 
committee concerned

_______________________________________________________________________

A BILL

To prohibit purchases of certain semiconductor manufacturing equipment 
from foreign entities of concern or subsidiaries of foreign entities of 
concern, and for other purposes.

Be it enacted by the Senate and House of Representatives of the 
United States of America in Congress assembled,

SECTION 1. SHORT TITLE.

This Act may be cited as the ``Chip Equipment Quality, Usefulness, 
and Integrity Protection Act of 2025'' or the ``Chip EQUIP Act''.

SEC. 2. PURCHASES OF SEMICONDUCTOR MANUFACTURING EQUIPMENT.

(a) Definitions.--Section 9901 of the William M. (Mac) Thornberry 
National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 
4651) is amended by adding at the end the following:
``(14) The term `completed, fully assembled', with respect 
to semiconductor manufacturing equipment, means the state in 
which all (or substantially all) necessary parts, chambers, 
subsystems, and subcomponents have been put together, resulting 
in such equipment that is--
``(A) ready-to-use or ready-to-install; and
``(B) ready to be purchased directly from an 
entity.
``(15) The term `ineligible semiconductor manufacturing 
equipment'--
``(A) means completed, fully assembled equipment 
that is manufactured, assembled, or refurbished by a 
foreign entity of concern or subsidiary thereof and 
designed for use in the fabrication, assembly, testing, 
advanced packaging, production, or research and 
development of semiconductors;
``(B) includes--
``(i) deposition equipment;
``(ii) etching equipment;
``(iii) lithography equipment;
``(iv) inspection, measuring, and test 
equipment;
``(v) wafer slicing equipment;
``(vi) wafer dicing equipment;
``(vii) wire bonders;
``(viii) ion implantation equipment;
``(ix) chemical mechanical polishing;
``(x) diffusion or oxidation furnaces;
``(xi) thermal processing equipment; and
``(xii) automated material handling 
systems; and
``(C) does not include any part, chamber, 
subsystem, or subcomponent that enables or is 
incorporated into such equipment.''.
(b) Ineligible Use of Funds.--Section 9909 of the William M. (Mac) 
Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 
U.S.C. 4659) is amended--
(1) by redesignating subsection (f) as subsection (g); and
(2) by inserting after subsection (e) the following new 
subsection:
``(f) Ineligible Use of Funds.--
``(1) In general.--Subject to paragraph (2), the Secretary 
shall include in the terms of each agreement with a covered 
entity for the award of Federal financial assistance under 
section 9902, or with the recipient of an award made under 
section 9906, prohibitions with respect to a project relating 
to the procurement, installation, or use of ineligible 
semiconductor manufacturing equipment, to be effective for 10 
years beginning on the date on which the agreement is signed.
``(2) Waiver.--The Secretary may waive the prohibitions 
referred to in paragraph (1) if--
``(A) the ineligible semiconductor manufacturing 
equipment to be purchased by the applicable covered 
entity is not produced in the United States or an 
allied or partner country in sufficient and reasonably 
available quantities or of a satisfactory quality to 
support established or expected production 
capabilities;
``(B) the ineligible semiconductor manufacturing 
equipment at issue was manufactured or assembled by an 
entity that is not a foreign entity of concern or 
subsidiary thereof and was refurbished by a foreign 
entity of concern or subsidiary thereof; or
``(C)(i) the use of the ineligible semiconductor 
manufacturing equipment complies with the requirements 
set forth in the Export Administration Regulations (as 
such term is defined in section 1742 of the Export 
Control Reform Act of 2018 (50 U.S.C. 4801)); and
``(ii) the Secretary, in consultation with 
the Director of National Intelligence or the 
Secretary of Defense, determines such waiver is 
in the national security interest of the United 
States.
``(3) Foreign entities of concern.--Nothing in this 
subsection may be construed to waive the application of section 
9907.''.
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